Description

The unique mechanical feature of MiniSKiiP modules is the outstandingly easy assembly and service friendly spring contact technology. Compared to conventional solder or press-fit modules, where specific equipment (automated presses, wave soldering machine) is required, no dedicated tools are needed for MiniSKiiP assembly. Instead, a single or a two screw connection is used.

The printed circuit board (PCB), the power module and the heat sink are assembled in one mounting step. This connection technology features a number of additional advantages: the PCB can be more flexible in design, as the printed circuit board does not need to include holes for solder pins or pressfit connections. The springs provide a flexible connection between the PCB and the power circuitry which is far superior to a soldered joint, particularly under thermal or mechanical stress conditions which can affect lifetime. Thanks to the high mechanical pressure provided by the springs, an air-tight, reliable electrical connection is achieved.

SKIIP 38GB17E4V1
SKIIP 16GH066V1
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