Description
The half-bridge topologies come with a selection of choices for connection technologies such as press-fit and spring contact as well as for the integration level: current measurement shunts can be included in the power module, plug & play driver solutions and pre-printed Phase Change Material can be supplied to shorten the time-to-market and development times.
The family concept behind SEMiX includes uniform IGBT and rectifier housings. All have the same height (17mm) and can be connected by one principle DC-link design. This saves development time and makes a simple and low-inductance DC-link profile possible. Spring or press-fit contacts allow a gate driver to be mounted directly on top of the module, eliminating the risk of noise on wires or loose connectors. Thanks to the flat package and separate AC and DC terminals, a highly compact, state-of-the-art inverter designs are possible. The auxiliary contacts, avoid solder joints and offer highly reliable spring and press-fit contacts. This leads to an increased product reliability and lifetime.
The solder-free contacts make for quick and easy assembly. Production at the customer site can be optimised by using a uniform direction of assembly (everything top down). This simplifies logistics and reduces manufacturing costs. The half-bridge topologies come with a selection of choices for connection technologies such as press-fit and spring contact as well as for the integration level: current measurement shunts can be included in the power module, Plug-and-Play driver solutions and pre-printed phase change material can be supplied to shorten the time-to-market and development times.
